Mounter Terminology
(A~C)
Pib nrog tsab ntawv A
Qhov tseeb: Qhov sib txawv ntawm qhov ntsuas qhov ntsuas thiab tus nqi phiaj.
Cov Txheej Txheem Ntxiv: Ib txoj hauv kev ua PCB conductive thaiv los ntawm kev xaiv tso cov khoom siv hluav taws xob (tooj liab, tin, thiab lwm yam) ntawm cov txheej txheem.
Adhesion: Zoo ib yam li attraction ntawm molecules.
Aerosol: Kua los yog gaseous hais me me kom muaj cua.
Lub kaum sab xis ntawm kev tawm tsam: lub kaum sab xis ntawm lub vijtsam luam ntawv squeegee nto thiab lub dav hlau luam ntawv.
Anisotropic adhesive: Ib qho khoom siv hluav taws xob uas nws cov khoom dhau tam sim no tsuas yog hauv Z-axis kev coj.
Lub nplhaib Annular: Cov khoom siv hluav taws xob nyob ib ncig ntawm lub qhov drilled.
Daim ntawv thov tshwj xeeb kev sib xyaw ua ke (ASIC tshwj xeeb daim ntawv thov kev sib xyaw ua ke): ib qho kev hloov kho los ntawm cov neeg siv khoom rau lub hom phiaj tshwj xeeb.
Array (array): Ib txheej ntawm cov ntsiab lus, xws li cov ntsiab lus ntawm lub pob, muab tso rau hauv kab thiab kab.
Artwork (wiring diagram): Cov kab hluav taws xob txuas hluav taws xob ntawm PCB, siv los tsim cov duab qub, tuaj yeem ua rau txhua qhov teev, tab sis feem ntau 3: 1 lossis 4: 1.
Cov cuab yeej ntsuas hluav taws xob tsis siv neeg (ATE): Cov cuab yeej tsim los txiav txim siab ua haujlwm lossis qhov tsis zoo li qub txhawm rau txheeb xyuas qib kev ua haujlwm, thiab rau kev sib cais txhaum.
Kev tshuaj xyuas tsis siv neeg kho qhov muag (AOI): Ntawm lub tshuab tsis siv neeg, lub koob yees duab siv los tshuaj xyuas tus qauv lossis khoom siv.
Pib nrog tsab ntawv B
Ball grid array (BGA pob grid array): Daim ntawv ntim ntawm kev sib xyaw ua ke, uas nws cov ntsiab lus tawm tswv yim thiab cov ntsiab lus tawm yog cov khoom siv sib xyaw ua ke hauv cov qauv kab sib chaws hauv qab ntawm cov khoom.
Qhov muag tsis pom ntawm: Ib qho kev sib txuas ntawm cov txheej txheej sab nrauv thiab txheej txheej hauv PCB uas tsis txuas mus rau lwm sab ntawm lub rooj tsavxwm.
Bond lift-off: Qhov tsis ua hauj lwm ntawm kev sib cais cov pins ntawm lub ncoo saum npoo (circuit board substrate).
Bonding tus neeg sawv cev: Ib qho nplaum uas khi ib txheej los ua ntau txheej txheej.
Choj: solder uas txuas ob conductors uas yuav tsum tau conductively txuas, ua rau ib tug luv luv Circuit Court.
faus ntawm: Ib qho kev sib txuas ntawm ob lossis ntau txheej sab hauv ntawm PCB (piv txwv li, pom tsis pom los ntawm cov txheej txheem sab nrauv).
Pib nrog tsab ntawv C
CAD/CAM system (computer-aided design and manufacturing system): Computer-aided design yog siv cov cuab yeej software tshwj xeeb los tsim cov qauv luam tawm; computer-aided manufacturing converts qhov tsim no rau hauv cov khoom tiag. Cov tshuab no suav nrog lub cim xeeb loj heev rau kev ua cov ntaub ntawv thiab kev khaws cia, cov tswv yim rau kev tsim qauv, thiab cov khoom siv tso tawm uas hloov cov ntaub ntawv khaws cia rau hauv cov duab thiab cov ntawv ceeb toom.
Capillary nkaus: Ib qho tshwm sim ntuj tsim uas ua rau cov molten solder ntws ntawm cov khoom sib txuas sib txuas tiv thaiv lub ntiajteb txawj nqus.
Chip on board (COB): Ib tug hybrid thev naus laus zis uas siv cov khoom siv nti uas ua rau lub ntsej muag, ib txwm txuas tshwj xeeb rau cov txheej txheej substrate ntawm lub rooj tsav xwm los ntawm kev ya.
Circuit tester: Ib txoj hauv kev sim PCBs thaum lub sijhawm tsim khoom loj. Xws li: rab koob txaj, tiv thaiv tus pin hneev taw, qhia kev sojntsuam, cov kab hauv qab, cov khoom thauj khoom, cov laug cam, thiab cov khoom kuaj xyuas.
Cladding: Ib txheej nyias ntawm cov ntawv hlau yog sib txuas rau lub rooj tsavxwm txheej los tsim cov txheej txheem PCB.
Coefficient ntawm thermal expansion: Thaum qhov kub thiab txias ntawm cov khoom nce, qhov ntsuas qhov ntsuas ib lab (ppm) ntawm cov khoom nthuav tawm ib qhov ntsuas kub
Kev ntxuav txias: Cov txheej txheem organic dissolution qhov twg cov kua sib cuag ua tiav qhov kev tshem tawm cov seem tom qab vuam.
Cold solder Joint: Ib qho kev sib koom ua ke uas qhia txog kev ntub dej tsis txaus thiab muaj qhov pom ntawm grey thiab ntxeem tau vim cua sov tsis txaus lossis kev tu tsis raug.
Component density: Tus naj npawb ntawm cov khoom ntawm PCB muab faib los ntawm thaj tsam ntawm lub rooj tsavxwm.
Conductive epoxy: Cov khoom siv polymeric uas tau ua kom dhau qhov hluav taws xob los ntawm kev ntxiv cov khoom hlau, feem ntau yog nyiaj.
Conductive ink: Ib qho nplaum siv rau ntawm cov ntaub ntawv tuab tuab los tsim cov qauv siv hluav taws xob PCB.
Conformal txheej: Ib txheej txheej tiv thaiv nyias siv rau PCB uas ua raws li cov duab sib dhos.
Copper foil (copper foil): cov khoom siv anionic electrolytic, nyias, nruam hlau ntawv tso rau ntawm lub hauv paus txheej ntawm lub rooj tsav xwm Circuit Court, uas ua raws li tus neeg xyuas pib ntawm PCB. Nws yooj yim ua raws li cov txheej txheem insulating, lees txais cov txheej txheem luam tawm, thiab ua cov qauv hauv Circuit Court tom qab etching.
Copper Mirror Test: Ib qho kev kuaj flux corrosion siv lub tshuab nqus tsev tso rau ntawm lub iav phaj.
Kev Kho: Ib qho kev hloov ntawm lub cev ntawm cov khoom, los ntawm cov tshuaj tiv thaiv, los yog los ntawm lub siab / tsis muaj siab rau cua sov.
Lub voj voog tus nqi: Ib lub sij hawm muab tso rau hauv cov khoom siv los ntsuas lub tshuab ceev los ntawm kev noj, qhov chaw thiab rov qab mus rau lub rooj tsavxwm, kuj hu ua kev ntsuas ceev.
(D~F)
pib nrog tsab ntawv D
Cov ntaub ntawv kaw lus: Ib lub cuab yeej uas ntsuas thiab sau qhov kub thiab txias los ntawm cov thermocouples txuas rau PCB ntawm lub sijhawm tshwj xeeb.
Qhov tsis xws luag: Ib qho khoom tivthaiv lossis chav ntsuas hluav taws xob sib txawv ntawm ib txwm lees txais cov yam ntxwv.
Delamination: delamination ntawm ply thiab sib cais ntawm ply thiab conductive cover.
Desoldering: Kev tshem tawm cov khoom siv los kho lossis hloov pauv, suav nrog: nqus cov tin nrog tin suction daim kab xev, lub tshuab nqus tsev (solder pipette), thiab kub kos duab.
Dewetting: Cov txheej txheem uas molten solder yog thawj zaug thiab tom qab ntawd thim rov qab, tawm hauv qhov tsis sib xws.
DFM (Design for Manufacturing): Ib txoj hauv kev tsim cov khoom lag luam zoo tshaj plaws, suav nrog lub sijhawm, nqi thiab cov peev txheej muaj.
Dispersant: Ib qho tshuaj ntxiv rau hauv dej kom nws muaj peev xwm de-particulate.
Cov ntaub ntawv: Cov ntaub ntawv ntawm kev sib dhos, piav qhia cov qauv tsim qauv, hom thiab qhov ntau ntawm cov khoom siv thiab cov khoom siv, cov lus qhia tshwj xeeb tsim, thiab cov kev hloov kho tshiab kawg. Peb hom yog siv: prototypes thiab low-volume runs, standard production line and/loss production quantities, and the government contracts that specifically graphs.
Lub sij hawm poob: Lub sij hawm thaum cov khoom siv tsis tsim khoom vim kev saib xyuas lossis tsis ua haujlwm.
Durometer: Ntsuas cov roj hmab los yog yas hardness ntawm cov hniav scraper.
Pib nrog tsab ntawv E
Kev xeem ib puag ncig: Ib qho kev sim lossis cov kev xeem siv los txiav txim siab tag nrho cov kev cuam tshuam sab nraud ntawm cov txheej txheem, txhua yam thiab kev ua haujlwm zoo ntawm cov khoom siv los yog cov khoom sib dhos.
Eutectic solders: Ob lossis ntau dua hlau alloys nrog qhov qis tshaj plaws melting point, thaum rhuab, eutectic alloy hloov ncaj qha los ntawm cov khoom mus rau cov kua yam tsis tau mus txog theem yas.
pib nrog tsab ntawv F
Fabrication (): Cov txheej txheem ntawm lub rooj tsavxwm khoob ua ntej sib dhos tom qab tsim, cov txheej txheem ntawm tus kheej muaj xws li stackup, hlau ntxiv / rho tawm, drilling, plating, routing, thiab tu.
Fiducial (fiducial point): Ib qho cim tshwj xeeb nrog rau daim duab kab hluav taws xob, uas yog siv rau kev pom lub tshuab kom pom cov kev taw qhia thiab txoj hauj lwm ntawm daim duab thaiv.
Fillet: Ib qho kev sib txuas tsim los ntawm kev sib txuas ntawm lub ncoo thiab tus pin tivthaiv. ie cov pob qij txha.
Fine-pitch technology (FPT fine-pitch thev naus laus zis): Qhov nruab nrab-rau-nruab nrab qhov sib nrug ntawm cov pob khoom sib txuas yog 0.025" (0.635mm) lossis tsawg dua.
Fixture: Ib qho khoom siv uas txuas PCB mus rau qhov chaw ntawm lub tshuab ua haujlwm.
Flip nti: Ib qho qauv siv lead ua uas feem ntau muaj cov khoom siv hluav taws xob. Tsim los rau kev sib txuas ntawm hluav taws xob thiab khoom siv hluav taws xob rau ib lub voj voog los ntawm tus naj npawb tsim nyog ntawm cov pob solder (them nrog cov nplaum nplaum) ntawm nws lub ntsej muag.
Tag nrho cov kua dej kub: Qhov kub thiab txias ntawm lub solder ncav cuag nws lub siab tshaj plaws kua lub xeev, zoo tshaj plaws haum rau zoo wetting.
Functional test (functional test): simulate nws qhov kev xav tau ntawm qhov chaw ua haujlwm, ntsuas hluav taws xob ntawm tag nrho lub rooj sib txoos.
(G~R)
Pib nrog tsab ntawv G
Golden tub: Ib qho kev tivthaiv lossis kev sib dhos hauv Circuit Court uas tau sim thiab paub tias ua haujlwm raws li kev qhia tshwj xeeb thiab yog siv los sim lwm cov units los ntawm kev sib piv.
pib nrog tsab ntawv H
Halides: Cov tshuaj muaj fluorine, chlorine, bromine, iodine lossis astatine. Nws yog ib feem catalyst ntawm cov flux, uas yuav tsum tau muab tshem tawm vim nws corrosiveness.
Cov dej tawv: Cov dej muaj cov calcium carbonate thiab lwm yam ions uas tuaj yeem sau rau ntawm qhov chaw sab hauv ntawm cov khoom siv huv si thiab ua rau muaj kev cuam tshuam.
Hardener: Ib qho tshuaj ntxiv rau cov resin los ua kom ntxov ntxov, piv txwv li tus neeg sawv cev kho.
Kuv pib nrog tsab ntawv
In-circuit test: Ib qho kev ntsuam xyuas los ntawm cov khoom siv los txheeb xyuas qhov kev tso kawm thiab kev taw qhia.
Pib nrog tsab ntawv J
Just-in-time (JIT): Txo cov khoom muag los ntawm kev muab cov khoom thiab cov khoom ncaj qha mus rau cov kab ntau lawm ua ntej kev tsim khoom.
Pib nrog tsab ntawv L
Lead configuration: Ib tus neeg xyuas pib txuas los ntawm cov khoom siv uas ua raws li cov khoom siv hluav taws xob thiab hluav taws xob sib txuas.
Kab ntawv pov thawj: Paub meej tias cov kab ntau lawm yog tswj tau thiab cov PCBs txhim khu kev qha tuaj yeem tsim tau raws li qhov xav tau.
pib nrog tsab ntawv M
Lub zeem muag ntawm lub tshuab: Ib lossis ntau lub koob yees duab siv los pab nrhiav cov chaw zov me nyuam lossis txhim kho cov txheej txheem kev tso kawm kom raug.
Lub sij hawm nruab nrab ntawm qhov tsis ua hauj lwm (MTBF lub sij hawm nruab nrab ntawm qhov tsis ua hauj lwm): Lub sij hawm nruab nrab ntawm cov sij hawm nruab nrab ntawm qhov xav tau kev ua haujlwm ua haujlwm tsis ua haujlwm, feem ntau suav ib teev, cov txiaj ntsig yuav tsum qhia qhov tseeb, xav tau lossis suav.
Pib nrog tsab ntawv N
Nonwetting: Ib qho xwm txheej uas solder tsis ua raws li cov hlau nto. Tsis-wetting yog tus cwj pwm los ntawm pom raug ntawm lub hauv paus hlau vim muaj paug ntawm qhov chaw yuav tsum tau welded.
Pib nrog tsab ntawv O
Omegameter: Ib lub 'meter' siv los ntsuas cov nyiaj seem ntawm cov ions nyob rau saum npoo ntawm PCB los ntawm immersing lub rooj sib tham nyob rau hauv ib tug sib tov ntawm cawv thiab dej ntawm paub siab resistivity, tom qab ntawd ntsuas thiab sau cov nyiaj seem ntawm ions vim residual ions Resistivity tee.
Qhib: Ob lub ntsiab lus ntawm kev sib txuas hluav taws xob (pins thiab pads) tau sib cais, vim yog tsis txaus los yog vim tsis muaj kev sib txuas ntawm cov pins txuas.
Organic activated (OA): Lub cev muaj zog nrog cov organic acids ua activators, dej-soluble.
Pib nrog tsab ntawv P
Ntim ntom ntom: Tus naj npawb ntawm cov khoom (cov khoom siv ua haujlwm / passive, cov khoom sib txuas, thiab lwm yam) muab tso rau ntawm PCB; hais tias qis, nruab nrab, lossis siab.
Photoploter: Cov txheej txheem txheej txheem txheej txheem siv los tsim thawj PCB layouts (feem ntau qhov loj me) ntawm cov duab tsis zoo.
Pick-and-place: Lub tshuab programmable nrog lub caj npab neeg hlau uas xaiv cov khoom siv los ntawm cov khoom siv tsis siv neeg, txav lawv mus rau qhov chaw ruaj khov ntawm PCB, thiab muab lawv tso rau hauv qhov chaw nyob hauv qhov kev taw qhia kom raug.
Cov cuab yeej muab tso rau: lub tshuab uas sib txuas cov kev kub ceev thiab qhov chaw raug muab tso rau hauv PCB, muab faib ua peb hom: kev hloov loj ntawm SMD, X / Y qhov chaw thiab hauv-kab hloov tshuab, uas tuaj yeem ua ke kom haum rau cov khoom siv hauv Circuit Court board. tsim.
pib nrog tsab ntawv R
Reflow soldering: Cov txheej txheem ntawm kev tso cov khoom siv saum npoo rau hauv cov tshuaj pleev xim rau kev sib txuas mus tas li los ntawm ntau theem xws li: preheating, stabilization / ziab, reflow peaking, thiab txias.
Kho: Qhov kev txiav txim ntawm kev rov ua haujlwm ntawm lub rooj sib txoos tsis zoo.
Repeatability: Lub peev xwm ntawm cov txheej txheem kom raug rov qab mus rau lub hom phiaj yam ntxwv. Ib qho metric los ntsuas cov cuab yeej ua haujlwm thiab nws qhov txuas ntxiv.
Rework: Ib qho kev rov ua dua tshiab ntawm kev coj cov kev sib dhos tsis raug rov qab rau hauv kev ua raws li cov lus qhia lossis cov lus cog tseg.
Rheology: Piav qhia txog qhov ntws ntawm cov kua, los yog nws cov viscosity thiab qhov nro nro, piv txwv li, solder paste.
(S~Z)
Pib nrog tsab ntawv S
Saponifier: Ib qho kev daws teeb meem ntawm cov organic lossis inorganic cov khoom xyaw tseem ceeb thiab cov khoom siv ntxiv los pab txhawb kev tshem tawm cov rosin thiab dej-soluble fluxes los ntawm, piv txwv li, dispersible cleaners.
Schematic: Ib daim duab uas siv cov cim los sawv cev rau kev teeb tsa hauv Circuit Court, suav nrog kev sib txuas hluav taws xob, cov khoom siv, thiab kev ua haujlwm.
Semi-aqueous tu: Ib qho txheej txheem uas muaj cov kuab tshuaj ntxuav, dej kub yaug, thiab lub voj voog kom qhuav.
Duab ntxoov ntxoo: Hauv infrared reflow soldering, lub cev ntawm cov khoom tiv thaiv thaiv lub zog los ntawm qee qhov chaw, ua rau muaj qhov tshwm sim qhov kub thiab txias tsis txaus kom yaj tag nrho cov tshuaj txhuam.
Silver chromate test: Ib qho zoo, kev kuaj pom muaj halide ions hauv RMA flux. (RMA kev ntseeg siab, kev ruaj ntseg thiab muaj)
Slump: Lub diffusion ntawm solder paste, kua nplaum thiab lwm yam ntaub ntawv ua ntej kho tom qab stencil screen printing.
Solder pob (lub pob solder): Cov khoom siv zoo li lub pob yog sib txuas rau qhov chaw sib cuag ntawm cov khoom siv hluav taws xob lossis cov khoom siv nquag, thiab ua lub luag haujlwm ntawm kev sib txuas nrog lub voj voog.
Solderability: Lub peev xwm ntawm tus neeg xyuas pib (tus pin, ncoo lossis kab) kom ntub dej (ua tau solderable) thiaj li tsim kom muaj kev sib txuas zoo.
Soldermask: Cov txheej txheem ua haujlwm rau lub rooj tsav xwm luam tawm uas txhua qhov chaw tshwj tsis yog cov ntsiab lus sib txuas uas yuav tsum tau soldered yog them nrog txheej yas.
Khoom: Nyob rau hauv lub flux formulation, qhov hnyav feem pua ntawm rosin, (cov ntsiab lus khoom)
Solidus: Qhov kub ntawm cov hlau nplaum ntawm qee cov khoom pib yaj (liquefy).
Kev Tswj Xyuas Txheej Txheem Txheej Txheem (SPC): Kev siv cov txheej txheem txheeb xyuas los txheeb xyuas cov txheej txheem tsim tawm thiab nws cov txiaj ntsig los coj kev nqis tes ua, kho thiab / lossis tswj lub xeev ntawm kev tswj hwm zoo.
Cia lub neej: Lub sijhawm uas cov kua nplaum khaws cia thiab tseem siv tau.
Cov txheej txheem rho tawm: Los ntawm kev tshem tawm cov ntawv hlau conductive lossis npog