Yuav ua li cas tiv thaiv cov ntxa tsis xws luag nyob rau hauv SMT Assom
Causes : Uneven pad heating (ΔT >5°C between pads). Incorrect stencil design (asymmetrical solder volume). Excessive placement offset (>30% ntawm cov ntaub dav dav). Kev daws teeb meem: Kev Tsim Tshuaj Pad: Nce Thermal nyem ntawm Pad loj dua. Khaws daim ncoo loj dua tsawg dua lossis muaj sib npaug rau 1: 1.5 rau cov khoom siv ua ke. Refow ...
Khoom Taw qhia
Ua:
Uneven pad heating (ΔT >5 degree ntawm cov tshuaj).
Tsis yog Stencil tsim (asymmetrical solder ntim).
Excessive placement offset (>30% ntawm cov ntaub dav dav).
Cov kev daws teeb meem:
Ntawv Tsim:
Nce cua kub ntawm cov ncoo loj dua.
Khaws daim ncoo loj dua tsawg dua lossis muaj sib npaug rau 1: 1.5 rau cov khoom siv ua ke.
Refow Profile:
Preheat nqes hav<1.5°C/sec to balance temperature.
Soak lub sijhawm 60-90} sec ntawm 150-180 degree.
Txheej Txheem Tswj:
Siv 3D SPI los xyuas cov tshuaj pleev muab tshuaj pleev muab tso rau ib yam nkaus.
Cim npe nrov: Yuav ua li cas tiv thaiv cov ntxa tsis xws luag nyob rau hauv SMT los ua ke, Suav, Hoobkas, pricelivized, pricelist, tus nqi qis, yuav luv nqi
Koj Tseem Yuav Zoo Li
Xa kev nug
